Assignee
OH JUN-HWAN
0 granted patents·3 pending applications·0 citations·filing 2007–2008
Top patents by PatentIndex Score
3 records- 0147US2008299764A1Interconnection having dual-level or multi-level capping layer and method of forming the sameOH JUN-HWAN·Filed 2008·Application pending·0 cites
- 0243US2009017615A1Method of removing an insulation layer and method of forming a metal wireOH JUN-HWAN·Filed 2008·Application pending·0 cites
- 0342US2008073787A1Method forming metal interconnection filling recessed region using electro-plating techniqueOH JUN-HWAN·Filed 2007·Application pending·0 cites
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