Assignee
OHNISHI TSUKASA
JP·3 granted patents·1 pending application·9 citations·filing 2004–2012
Top patents by PatentIndex Score
4 records- 0176US9527167B2Lead-free solder ballOHNISHI TSUKASA·Filed 2012·Granted Dec 27, 2016·4 cites·13 claims
- 0264US8220692B2Lead-free solderOHNISHI TSUKASA·Filed 2009·Granted Jul 17, 2012·2 cites·5 claims
- 0363US8691143B2Lead-free solder alloyOHNISHI TSUKASA·Filed 2006·Granted Apr 8, 2014·3 cites·4 claims
- 0435US2007243098A1Lead-Free SolderOHNISHI TSUKASA·Filed 2004·Application pending·0 cites
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