Assignee
OHTA TETSUJI
JP·3 granted patents·3 citations·filing 2007–2008
Top patents by PatentIndex Score
3 records- 0172US8206828B2Material for forming electroless plate and method for forming electroless plate using the sameOHTA TETSUJI·Filed 2007·Granted Jun 26, 2012·2 cites·5 claims
- 0268US8389123B2Material for forming electroless plate, coating solution for adhering catalyst, method for forming electroless plate, and plating methodOHTA TETSUJI·Filed 2008·Granted Mar 5, 2013·1 cites·14 claims
- 0353US8734958B2Material for forming electroless plate, coating solution for adhering catalyst, method for forming electroless plate, and plating methodOHTA TETSUJI·Filed 2008·Granted May 27, 2014·0 cites·4 claims
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