Assignee
OIKAWA RYUICHI
JP·3 granted patents·7 citations·filing 2009–2011
Top patents by PatentIndex Score
3 records- 0178US9006910B2Interconnection structureOIKAWA RYUICHI·Filed 2011·Granted Apr 14, 2015·6 cites·15 claims
- 0260US8253421B2Impedance measurement method and impedance measurement deviceOIKAWA RYUICHI·Filed 2010·Granted Aug 28, 2012·1 cites·15 claims
- 0346US8104013B2Design method of semiconductor package substrate to cancel a reflected waveOIKAWA RYUICHI·Filed 2009·Granted Jan 24, 2012·0 cites·16 claims
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