Assignee
OLIN CORP A CORP OF THE COMMON
US·0 granted patents·3 pending applications·0 citations·filing 2003–2004
Top patents by PatentIndex Score
3 records- 0140US2004175582A1Laser ablation resistant copper foilOLIN CORP A CORP OF THE COMMON·Filed 2004·Application pending·0 cites
- 0240US2005118448A1Laser ablation resistant copper foilOLIN CORP A CORP OF THE COMMON·Filed 2004·Application pending·0 cites
- 0335US2004046247A1Hermetic semiconductor packageOLIN CORP A CORP OF THE COMMON·Filed 2003·Application pending·0 cites
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