Assignee
OLSON KEVIN C
US·4 granted patents·1 citations·filing 2007–2011
Top patents by PatentIndex Score
4 records- 0157US8141245B2Method of forming a circuit board with improved via designOLSON KEVIN C·Filed 2008·Granted Mar 27, 2012·1 cites·11 claims
- 0252US8409982B2Method of forming solid blind vias through the dielectric coating on high density interconnect (HDI) substrate materialsOLSON KEVIN C·Filed 2011·Granted Apr 2, 2013·0 cites·14 claims
- 0346US8598467B2Multi-layer circuit assembly and process for preparing the sameOLSON KEVIN C·Filed 2011·Granted Dec 3, 2013·0 cites·16 claims
- 0446US8065795B2Multi-layer circuit assembly and process for preparing the sameOLSON KEVIN C·Filed 2007·Granted Nov 29, 2011·0 cites·7 claims
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