Assignee
ONOZUKA IJI
JP·0 granted patents·2 pending applications·0 citations·filing 2006–2011
Top patents by PatentIndex Score
2 records- 0134US2009166060A1Insulating Resin Layer, Insulating Resin Layer With Carrier And Multiple-Layered Printed Wiring BoardONOZUKA IJI·Filed 2006·Application pending·0 cites
- 0232US2013242520A1Insulating substrate, metal-clad laminate, printed wiring board and semiconductor deviceONOZUKA IJI·Filed 2011·Application pending·0 cites
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