Assignee
OPTIMUM CARE INT TECH INC
TW·7 granted patents·15 pending applications·47 citations·filing 2004–2007
Top patents by PatentIndex Score
22 records- 0166US7074651B2Packaging method for integrated circuitsOPTIMUM CARE INT TECH INC·Filed 2004·Granted Jul 11, 2006·16 cites·3 claims
- 0261US7138704B2Concealable chip leadframe unit structureOPTIMUM CARE INT TECH INC·Filed 2004·Granted Nov 21, 2006·12 cites·8 claims
- 0357US7119436B2Memory moduleOPTIMUM CARE INT TECH INC·Filed 2004·Granted Oct 10, 2006·9 cites·20 claims
- 0451US7145779B2Memory moduleOPTIMUM CARE INT TECH INC·Filed 2004·Granted Dec 5, 2006·6 cites·20 claims
- 0547US7215540B2Memory moduleOPTIMUM CARE INT TECH INC·Filed 2004·Granted May 8, 2007·4 cites·20 claims
- 0644US2007275574A1Chip Assembly Structure With CoverOPTIMUM CARE INT TECH INC·Filed 2007·Application pending·0 cites
- 0739US2007007638A1Memory array module mounting structureOPTIMUM CARE INT TECH INC·Filed 2006·Application pending·0 cites
- 0839US2007096181A1Flexible memory moduleOPTIMUM CARE INT TECH INC·Filed 2006·Application pending·0 cites
- 0939US2007004093A1Method of fabricating a high-density lead arrangement package structureOPTIMUM CARE INT TECH INC·Filed 2006·Application pending·0 cites
- 1039US2007132111A1Fine-sized chip package structureOPTIMUM CARE INT TECH INC·Filed 2006·Application pending·0 cites
- 1138US2005121224A1Circuit board having deposit holesOPTIMUM CARE INT TECH INC·Filed 2004·Application pending·0 cites
- 1238US2005117314A1Assembly structure for hiding electronic componentsOPTIMUM CARE INT TECH INC·Filed 2004·Application pending·0 cites
- 1337US2006051899A1Method of forming precision leads on a chip-supporting leadframeOPTIMUM CARE INT TECH INC·Filed 2005·Application pending·0 cites
- 1437US2005115062A1Chip assembling structure and socketOPTIMUM CARE INT TECH INC·Filed 2004·Application pending·0 cites
- 1536US7309918B2Chip package structureOPTIMUM CARE INT TECH INC·Filed 2004·Granted Dec 18, 2007·0 cites·8 claims
- 1635US2005116325A1Switching media for chip carrier deviceOPTIMUM CARE INT TECH INC·Filed 2004·Application pending·0 cites
- 1735US2005179119A1Miniaturized chip scale package structureOPTIMUM CARE INT TECH INC·Filed 2004·Application pending·0 cites
- 1835US2005156289A1Semiconductor chip leadframe moduleOPTIMUM CARE INT TECH INC·Filed 2004·Application pending·0 cites
- 1935US2005224927A1Chip fixed structureOPTIMUM CARE INT TECH INC·Filed 2004·Application pending·0 cites
- 2035US2005184365A1High density lead arrangement package structureOPTIMUM CARE INT TECH INC·Filed 2004·Application pending·0 cites
- 2128US2007113108A1Memory with self-contained power supplyOPTIMUM CARE INT TECH INC·Filed 2006·Application pending·0 cites
- 2226US7204017B2Manufacturing method of a modularized leadframeOPTIMUM CARE INT TECH INC·Filed 2004·Granted Apr 17, 2007·0 cites·5 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →