Assignee
OR DEREK SIU WING
HK·2 granted patents·6 citations·filing 2009–2011
Top patents by PatentIndex Score
2 records- 0172US8833418B2Method and system for bonding electrical devices using an electrically conductive adhesiveOR DEREK SIU WING·Filed 2011·Granted Sep 16, 2014·4 cites·11 claims
- 0254US8129220B2Method and system for bonding electrical devices using an electrically conductive adhesiveOR DEREK SIU WING·Filed 2009·Granted Mar 6, 2012·2 cites·7 claims
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