Assignee
ORIENT SEMICONDUCTOR ELECTRONICS LTD
TW·3 granted patents·6 pending applications·3 citations·filing 2020–2024
Top patents by PatentIndex Score
9 records- 0185US11355356B1Manufacturing method of semiconductor package comprising heat spreaderORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Granted Jun 7, 2022·3 cites·4 claims
- 0260US2026068661A1Semiconductor package and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 0356US2025125216A1Die and manufacturing method thereof as well as semiconductor package with the sameORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 0454US2025062265A1Semiconductor package and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 0553US2025062281A1Semiconductor package and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 0646US11462454B2Semiconductor package comprising heat spreader and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Granted Oct 4, 2022·0 cites·6 claims
- 0745US11462485B2Electronic package including electromagnetic shielding structure and method of manufactureORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Granted Oct 4, 2022·0 cites·11 claims
- 0843US2021005574A1Semiconductor package and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2020·Application pending·0 cites
- 0939US2022285217A1Wafer thinning methodORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Application pending·0 cites
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