Assignee
OSADA MICHIO
JP·3 granted patents·119 citations·filing 1985–1988
Top patents by PatentIndex Score
3 records- 0185US4793785AApparatus of multiplunger type for enclosing semiconductor elements with resinOSADA MICHIO·Filed 1987·Granted Dec 27, 1988·55 cites·5 claims
- 0273US4723899AMolding apparatus for enclosing semiconductor chips with resinOSADA MICHIO·Filed 1985·Granted Feb 9, 1988·33 cites·5 claims
- 0366US4862586ALead frame for enclosing semiconductor chips with resinOSADA MICHIO·Filed 1988·Granted Sep 5, 1989·31 cites·6 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →