Assignee

OSAJIMA TETSUYA

JP·1 granted patent·17 citations·filing 2006–2006

Technology mixB23K1 B28D1 H10P1

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0186US8513567B2Laser processing method for forming a modified region for cutting in an objectOSAJIMA TETSUYA·Filed 2006·Granted Aug 20, 2013·17 cites·11 claims

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