Assignee
OTHIENO MAURICE O
US·2 granted patents·13 citations·filing 2009–2010
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0183US8163643B1Enhanced pad design for solder attach devicesOTHIENO MAURICE O·Filed 2010·Granted Apr 24, 2012·12 cites·20 claims
- 0255US8129759B2Semiconductor package and method using isolated VSS plane to accommodate high speed circuitry ground isolationOTHIENO MAURICE O·Filed 2009·Granted Mar 6, 2012·1 cites·15 claims
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