Assignee
OTSUKA TAKUKAZU
JP·4 granted patents·12 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0182US8513806B2Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor deviceOTSUKA TAKUKAZU·Filed 2011·Granted Aug 20, 2013·7 cites·15 claims
- 0273US9673163B2Semiconductor device with flip chip structure and fabrication method of the semiconductor deviceOTSUKA TAKUKAZU·Filed 2011·Granted Jun 6, 2017·4 cites·17 claims
- 0354US8592986B2High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor deviceOTSUKA TAKUKAZU·Filed 2010·Granted Nov 26, 2013·1 cites·10 claims
- 0438US9761506B2Semiconductor device and fabrication method for the sameOTSUKA TAKUKAZU·Filed 2012·Granted Sep 12, 2017·0 cites·19 claims
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