Assignee

OUCHI AKIRA

JP·1 granted patent·7 citations·filing 2009–2009

Technology mixH05K1 H10P1 H10W1 Y02P1

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0169US8581403B2Electronic component mounting structure, electronic component mounting method, and electronic component mounting boardOUCHI AKIRA·Filed 2009·Granted Nov 12, 2013·7 cites·20 claims

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