Assignee
PAI DEEPAK K
US·3 granted patents·7 citations·filing 2006–2010
Top patents by PatentIndex Score
3 records- 0181US8549737B2Method of connecting a grid array package to a printed circuit boardPAI DEEPAK K·Filed 2010·Granted Oct 8, 2013·5 cites·9 claims
- 0252US8481862B2Low profile compliant leadsPAI DEEPAK K·Filed 2006·Granted Jul 9, 2013·2 cites·12 claims
- 0344US8196291B2Method for manufacturing leadsPAI DEEPAK K·Filed 2007·Granted Jun 12, 2012·0 cites·16 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →