Assignee
PAN YU-TANG
TW·3 granted patents·4 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0164US8772089B2Chip package structure and manufacturing method thereofPAN YU-TANG·Filed 2012·Granted Jul 8, 2014·2 cites·12 claims
- 0263US8652882B2Chip package structure and chip packaging methodPAN YU TANG·Filed 2011·Granted Feb 18, 2014·2 cites·6 claims
- 0338US8148827B2Quad flat no lead (QFN) packagePAN YU-TANG·Filed 2010·Granted Apr 3, 2012·0 cites·9 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →