Assignee
PARK HYUNGSANG
KR·3 granted patents·11 citations·filing 2008–2010
Top patents by PatentIndex Score
3 records- 0181US8569869B2Integrated circuit packaging system with encapsulation and method of manufacture thereofPARK HYUNGSANG·Filed 2010·Granted Oct 29, 2013·7 cites·20 claims
- 0265US8102666B2Integrated circuit package systemPARK HYUNGSANG·Filed 2008·Granted Jan 24, 2012·3 cites·10 claims
- 0357US8592973B2Integrated circuit packaging system with package-on-package stacking and method of manufacture thereofPARK HYUNGSANG·Filed 2009·Granted Nov 26, 2013·1 cites·20 claims
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