Assignee
PARK JUNGRAE
US·3 granted patents·2 pending applications·12 citations·filing 2014–2014
Top patents by PatentIndex Score
5 records- 0184US9196536B1Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch processPARK JUNGRAE·Filed 2014·Granted Nov 24, 2015·6 cites·21 claims
- 0282US9177861B1Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profilePARK JUNGRAE·Filed 2014·Granted Nov 3, 2015·5 cites·20 claims
- 0365US9281244B1Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch processPARK JUNGRAE·Filed 2014·Granted Mar 8, 2016·1 cites·8 claims
- 0443US2015243559A1Hybrid wafer dicing approach using temporally-controlled laser scribing process and plasma etchPARK JUNGRAE·Filed 2014·Application pending·0 cites
- 0543US2015287638A1Hybrid wafer dicing approach using collimated laser scribing process and plasma etchPARK JUNGRAE·Filed 2014·Application pending·0 cites
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