Assignee

PARK MI JIN

KR·1 granted patent·1 pending application·1 citations·filing 2012–2012

Technology mixH10W2 H01L1 H05K1 Y10T1

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2 records

0154US8987888B2Semiconductor package and semiconductor package module having the samePARK MI JIN·Filed 2012·Granted Mar 24, 2015·1 cites·15 claims
0231US2013075144A1Package substrate with mesh pattern and method for manufacturing the samePARK MI JIN·Filed 2012·Application pending·0 cites

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