Assignee
PARK SOOMOON
KR·3 granted patents·8 citations·filing 2008–2012
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0177US8569895B2Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor diePARK SOOMOON·Filed 2012·Granted Oct 29, 2013·4 cites·18 claims
- 0266US8143096B2Integrated circuit package system flip chipPARK SOOMOON·Filed 2008·Granted Mar 27, 2012·4 cites·20 claims
- 0346US8193036B2Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor diePARK SOOMOON·Filed 2010·Granted Jun 5, 2012·0 cites·20 claims
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