Assignee

PATTI ROBERT

US·2 granted patents·242 citations·filing 2010–2011

Technology mixH10W2

Top patents by PatentIndex Score

2 records

0197US8183127B2Method for bonding wafers to produce stacked integrated circuitsPATTI ROBERT·Filed 2010·Granted May 22, 2012·236 cites·12 claims
0280US8222121B2Fiducial scheme adapted for stacked integrated circuitsPATTI ROBERT·Filed 2011·Granted Jul 17, 2012·6 cites·6 claims

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