Assignee
PAUL SANKAR
US·3 granted patents·19 citations·filing 2009–2010
Top patents by PatentIndex Score
3 records- 0188US8632874B2Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewithPAUL SANKAR·Filed 2010·Granted Jan 21, 2014·10 cites·21 claims
- 0286US8257820B2Circuit materials with improved bond, method of manufacture thereof, and articles formed therefromPAUL SANKAR·Filed 2009·Granted Sep 4, 2012·6 cites·10 claims
- 0382US8519273B2Circuit materials with improved bond, method of manufacture thereof, and articles formed therefromPAUL SANKAR·Filed 2009·Granted Aug 27, 2013·3 cites·22 claims
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