Assignee
PAVIER MARK
GB·4 granted patents·1 pending application·12 citations·filing 2005–2009
Top patents by PatentIndex Score
5 records- 0171US8089147B2IMS formed as can for semiconductor housingPAVIER MARK·Filed 2006·Granted Jan 3, 2012·7 cites·20 claims
- 0265US8143729B2Autoclave capable chip-scale packagePAVIER MARK·Filed 2009·Granted Mar 27, 2012·4 cites·20 claims
- 0357US8552543B2Semiconductor packagePAVIER MARK·Filed 2007·Granted Oct 8, 2013·1 cites·20 claims
- 0450US9633951B2Semiconductor package including a semiconductor die having redistributed padsPAVIER MARK·Filed 2006·Granted Apr 25, 2017·0 cites·15 claims
- 0539US2005207133A1Embedded power management control circuitPAVIER MARK·Filed 2005·Application pending·0 cites
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