Assignee
PEP INNOVATION PTE LTD
SG·16 granted patents·6 pending applications·24 citations·filing 2016–2024
Top patents by PatentIndex Score
22 records- 0195US11114315B2Chip packaging method and package structurePEP INNOVATION PTE LTD·Filed 2020·Granted Sep 7, 2021·5 cites·20 claims
- 0289US10431477B2Method of packaging chip and chip package structurePEP INNOVATION PTE LTD·Filed 2017·Granted Oct 1, 2019·6 cites·42 claims
- 0386US11881415B2Method of packaging chip and chip package structurePEP INNOVATION PTE LTD·Filed 2021·Granted Jan 23, 2024·1 cites·9 claims
- 0485US12506055B2Chip packaging method and chip structurePEP INNOVATION PTE LTD·Filed 2021·Granted Dec 23, 2025·1 cites·15 claims
- 0579US11049734B2Method of packaging chip and chip package structurePEP INNOVATION PTE LTD·Filed 2017·Granted Jun 29, 2021·2 cites·32 claims
- 0677US11610855B2Chip packaging method and package structurePEP INNOVATION PTE LTD·Filed 2020·Granted Mar 21, 2023·1 cites·19 claims
- 0777US11232957B2Chip packaging method and package structurePEP INNOVATION PTE LTD·Filed 2020·Granted Jan 25, 2022·1 cites·20 claims
- 0876US11233028B2Chip packaging method and chip structurePEP INNOVATION PTE LTD·Filed 2020·Granted Jan 25, 2022·1 cites·17 claims
- 0974US11062917B2Packaging method, panel assembly, wafer package and chip packagePEP INNOVATION PTE LTD·Filed 2019·Granted Jul 13, 2021·1 cites·16 claims
- 1073US11538695B2Packaging method, panel assembly, wafer package and chip packagePEP INNOVATION PTE LTD·Filed 2019·Granted Dec 27, 2022·1 cites·20 claims
- 1169US10854531B2Semiconductor packaging method, semiconductor package and stacked semiconductor packagesPEP INNOVATION PTE LTD·Filed 2016·Granted Dec 1, 2020·3 cites·10 claims
- 1269US10615056B2Method of packaging chip and chip package structurePEP INNOVATION PTE LTD·Filed 2017·Granted Apr 7, 2020·1 cites·19 claims
- 1366US12080565B2Chip packaging method and package structurePEP INNOVATION PTE LTD·Filed 2021·Granted Sep 3, 2024·0 cites·14 claims
- 1464US2025149420A1Semiconductor package with at least one pre-made conductive unit and panel-level methods of making thereofPEP INNOVATION PTE LTD·Filed 2024·Application pending·0 cites
- 1563US2025022826A1Solder ball attachment system and method for preventing warpagePEP INNOVATION PTE LTD·Filed 2024·Application pending·0 cites
- 1662US2024404974A1Panel-level semiconductor packaging methodPEP INNOVATION PTE LTD·Filed 2024·Application pending·0 cites
- 1761US2024387222A1Method of compensating die shift in the compression moldingPEP INNOVATION PTE LTD·Filed 2024·Application pending·0 cites
- 1860US2024258260A1Semiconductor packaging method and the structure formed therefromPEP INNOVATION PTE LTD·Filed 2024·Application pending·0 cites
- 1956US11990431B2Semiconductor structures with via openings and methods of making the samePEP INNOVATION PTE LTD·Filed 2021·Granted May 21, 2024·0 cites·17 claims
- 2055US2025096182A1Power modules and panel-level methods of making the samePEP INNOVATION PTE LTD·Filed 2024·Application pending·0 cites
- 2150US11990353B2Semiconductor device with buffer layerPEP INNOVATION PTE LTD·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 2233US10504850B2Semiconductor processing methodPEP INNOVATION PTE LTD·Filed 2016·Granted Dec 10, 2019·0 cites·69 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →