Assignee
PHAM KEN
US·2 granted patents·1 pending application·0 citations·filing 2010–2011
Top patents by PatentIndex Score
3 records- 0142US8267303B2Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bondsPHAM KEN·Filed 2011·Granted Sep 18, 2012·0 cites·17 claims
- 0237US8283760B1Lead frame interconnect scheme with high power densityPHAM KEN·Filed 2010·Granted Oct 9, 2012·0 cites·11 claims
- 0334US2012032354A1Wirebonding method and device enabling high-speed reverse wedge bonding of wire bondsPHAM KEN·Filed 2011·Application pending·0 cites
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