Assignee
PHOENIX PREC TECHNOLOGY CORP
US·92 granted patents·72 pending applications·1,831 citations·filing 2001–2009
Top patents by PatentIndex Score
164 records- 0199US7321164B2Stack structure with semiconductor chip embedded in carrierPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Jan 22, 2008·150 cites·13 claims
- 0298US7639473B2Circuit board structure with embedded electronic componentsPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Dec 29, 2009·121 cites·25 claims
- 0398US7449363B2Semiconductor package substrate with embedded chip and fabrication method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Nov 11, 2008·75 cites·17 claims
- 0498US7312405B2Module structure having embedded chipsPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Dec 25, 2007·83 cites·17 claims
- 0597US7274099B2Method of embedding semiconductor chip in support platePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Sep 25, 2007·46 cites·4 claims
- 0696US7763969B2Structure with semiconductor chips embeded thereinPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Jul 27, 2010·62 cites·7 claims
- 0796US7242092B2Substrate assembly with direct electrical connection as a semiconductor packagePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Jul 10, 2007·49 cites·20 claims
- 0895US7485970B2Semiconductor package substrate having contact pad protective layer formed thereonPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Feb 3, 2009·37 cites·5 claims
- 0994US7705456B2Semiconductor package substratePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Granted Apr 27, 2010·38 cites·7 claims
- 1094US7592706B2Multi-layer circuit board with fine pitches and fabricating method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Sep 22, 2009·13 cites·6 claims
- 1192US7417299B2Direct connection multi-chip semiconductor element structurePHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted Aug 26, 2008·82 cites·8 claims
- 1292US7129117B2Method of embedding semiconductor chip in support plate and embedded structure thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted Oct 31, 2006·58 cites·19 claims
- 1391US7507915B2Stack structure of carrier boards embedded with semiconductor components and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Mar 24, 2009·31 cites·3 claims
- 1490US7656015B2Packaging substrate having heat-dissipating structurePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Granted Feb 2, 2010·24 cites·16 claims
- 1590US7626270B2Coreless package substrate with conductive structuresPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Dec 1, 2009·21 cites·6 claims
- 1690US7359590B2Semiconductor device integrated with optoelectronic componentsPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Apr 15, 2008·20 cites·15 claims
- 1790US7050304B2Heat sink structure with embedded electronic components for semiconductor packagePHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted May 23, 2006·64 cites·4 claims
- 1889US7112524B2Substrate for pre-soldering material and fabrication method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted Sep 26, 2006·39 cites·3 claims
- 1988US7382057B2Surface structure of flip chip substratePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Jun 3, 2008·16 cites·8 claims
- 2088US7081402B2Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2003·Granted Jul 25, 2006·34 cites·7 claims
- 2187US7579690B2Semiconductor package structurePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Granted Aug 25, 2009·17 cites·20 claims
- 2287US7453155B2Method for fabricating a flip chip packagePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Nov 18, 2008·15 cites·11 claims
- 2387US7239525B2Circuit board structure with embedded selectable passive components and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Jul 3, 2007·14 cites·19 claims
- 2486US7705446B2Package structure having semiconductor chip embedded therein and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Apr 27, 2010·14 cites·7 claims
- 2586US7174630B2Method for fabricating connection terminal of circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Feb 13, 2007·15 cites·14 claims
- 2685US7719104B2Circuit board structure with embedded semiconductor chip and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted May 18, 2010·14 cites·11 claims
- 2785US7656040B2Stack structure of circuit board with semiconductor component embedded thereinPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Feb 2, 2010·14 cites·16 claims
- 2885US7582961B2Package structure with circuits directly connected to semiconductor chipPHOENIX PREC TECHNOLOGY CORP·Filed 2008·Granted Sep 1, 2009·13 cites·18 claims
- 2985US7539022B2Chip embedded packaging structurePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted May 26, 2009·12 cites·9 claims
- 3085US7514786B2Semiconductor chip electrical connection structurePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Apr 7, 2009·13 cites·7 claims
- 3185US7514770B2Stack structure of carrier board embedded with semiconductor components and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Apr 7, 2009·15 cites·3 claims
- 3285US7041591B1Method for fabricating semiconductor package substrate with plated metal layer over conductive padPHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted May 9, 2006·41 cites·16 claims
- 3384US7754598B2Method for manufacturing coreless packaging substratePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Granted Jul 13, 2010·10 cites·14 claims
- 3484US7396753B2Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the samePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Jul 8, 2008·14 cites·7 claims
- 3583US7718470B2Package substrate and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted May 18, 2010·11 cites·6 claims
- 3683US7399399B2Method for manufacturing semiconductor package substratePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Jul 15, 2008·18 cites·6 claims
- 3781US7706148B2Stack structure of circuit boards embedded with semiconductor chipsPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Apr 27, 2010·10 cites·11 claims
- 3881US7674986B2Circuit board structure having capacitor array and embedded electronic component and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Mar 9, 2010·11 cites·14 claims
- 3981US7435618B2Method to manufacture a coreless packaging substratePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Oct 14, 2008·8 cites·11 claims
- 4080US7629204B2Surface roughening method for embedded semiconductor chip structurePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Dec 8, 2009·9 cites·13 claims
- 4180US7508006B2Circuit board structure of integrated optoelectronic componentPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Mar 24, 2009·8 cites·22 claims
- 4279US7674362B2Method for fabrication of a conductive bump structure of a circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2008·Granted Mar 9, 2010·7 cites·19 claims
- 4379US7619317B2Carrier structure for semiconductor chip and method for manufacturing the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Nov 17, 2009·9 cites·6 claims
- 4479US7608929B2Electrical connector structure of circuit board and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Oct 27, 2009·8 cites·5 claims
- 4579US6432748B1Substrate structure for semiconductor package and manufacturing method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2001·Granted Aug 13, 2002·27 cites·19 claims
- 4678US7768119B2Carrier structure embedded with semiconductor chipPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Aug 3, 2010·8 cites·12 claims
- 4778US7705471B2Conductive bump structure of circuit board and method for forming the samePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Apr 27, 2010·7 cites·11 claims
- 4878US7519244B2Circuit board with optoelectronic component embedded thereinPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Apr 14, 2009·8 cites·22 claims
- 4978US7419897B2Method of fabricating circuit board having different electrical connection structuresPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Sep 2, 2008·8 cites·14 claims
- 5078US7396700B2Method for fabricating thermally enhanced semiconductor devicePHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted Jul 8, 2008·25 cites·13 claims
Showing the top 50 of 164 patent records by PatentIndex Score.
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