Assignee
PHUA YOKE HOR
SG·2 granted patents·7 citations·filing 2011–2012
Top patents by PatentIndex Score
2 records- 0182US8524577B2Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressurePHUA YOKE HOR·Filed 2012·Granted Sep 3, 2013·7 cites·22 claims
- 0245US8513098B2Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressurePHUA YOKE HOR·Filed 2011·Granted Aug 20, 2013·0 cites·22 claims
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