Assignee
PIETSCH GEORG
DE·9 granted patents·39 citations·filing 2008–2012
Top patents by PatentIndex Score
9 records- 0189US8113913B2Method for the simultaneous grinding of a plurality of semiconductor wafersPIETSCH GEORG·Filed 2008·Granted Feb 14, 2012·22 cites·29 claims
- 0286US9199791B2Device and method for buffer-storing a multiplicity of wafer-type workpiecesPIETSCH GEORG·Filed 2012·Granted Dec 1, 2015·9 cites·12 claims
- 0372US8801500B2Method for the simultaneous material-removing processing of both sides of at least three semiconductor wafersPIETSCH GEORG·Filed 2011·Granted Aug 12, 2014·3 cites·9 claims
- 0464US9539695B2Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafersPIETSCH GEORG·Filed 2008·Granted Jan 10, 2017·3 cites·26 claims
- 0564US8911281B2Method for trimming the working layers of a double-side grinding apparatusPIETSCH GEORG·Filed 2011·Granted Dec 16, 2014·1 cites·5 claims
- 0662US8974267B2Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafersPIETSCH GEORG·Filed 2011·Granted Mar 10, 2015·1 cites·13 claims
- 0748US8851958B2Method for the simultaneous double-side material-removing processing of at least three workpiecesPIETSCH GEORG·Filed 2012·Granted Oct 7, 2014·0 cites·11 claims
- 0839US8795776B2Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatusPIETSCH GEORG·Filed 2012·Granted Aug 5, 2014·0 cites·13 claims
- 0939US8398878B2Methods for producing and processing semiconductor wafersPIETSCH GEORG·Filed 2010·Granted Mar 19, 2013·0 cites·27 claims
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