Assignee
PITNEY JOHN A
US·5 granted patents·62 citations·filing 2008–2011
Top patents by PatentIndex Score
5 records- 0194US8330245B2Semiconductor wafers with reduced roll-off and bonded and unbonded SOI structures produced from samePITNEY JOHN A·Filed 2011·Granted Dec 11, 2012·20 cites·46 claims
- 0289US8165706B2Methods for generating representations of flatness defects on wafersPITNEY JOHN A·Filed 2009·Granted Apr 24, 2012·16 cites·16 claims
- 0387US8440541B2Methods for reducing the width of the unbonded region in SOI structuresPITNEY JOHN A·Filed 2011·Granted May 14, 2013·8 cites·29 claims
- 0485US8186661B2Wafer holder for supporting a semiconductor wafer during a thermal treatment processPITNEY JOHN A·Filed 2008·Granted May 29, 2012·12 cites·10 claims
- 0579US8340801B2Systems for generating representations of flatness defects on wafersPITNEY JOHN A·Filed 2009·Granted Dec 25, 2012·6 cites·12 claims
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