Assignee
POLYMER FLIP CHIP CORP
US·6 granted patents·701 citations·filing 1995–2000
Top patents by PatentIndex Score
6 records- 0198US6410415B1Flip chip mounting techniquePOLYMER FLIP CHIP CORP·Filed 2000·Granted Jun 25, 2002·249 cites·39 claims
- 0297US6189208B1Flip chip mounting techniquePOLYMER FLIP CHIP CORP·Filed 1999·Granted Feb 20, 2001·168 cites·27 claims
- 0396US6219911B1Flip chip mounting techniquePOLYMER FLIP CHIP CORP·Filed 1999·Granted Apr 24, 2001·120 cites·8 claims
- 0494US6138348AMethod of forming electrically conductive polymer interconnects on electrical substratesPOLYMER FLIP CHIP CORP·Filed 1999·Granted Oct 31, 2000·90 cites·13 claims
- 0587US5879761AMethod for forming electrically conductive polymer interconnects on electrical substratesPOLYMER FLIP CHIP CORP·Filed 1995·Granted Mar 9, 1999·44 cites·7 claims
- 0679US5918364AMethod of forming electrically conductive polymer interconnects on electrical substratesPOLYMER FLIP CHIP CORP·Filed 1997·Granted Jul 6, 1999·30 cites·14 claims
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