Assignee
PRATT DAVE
US·5 granted patents·26 citations·filing 2008–2012
Top patents by PatentIndex Score
5 records- 0189US9136259B2Method of creating alignment/centering guides for small diameter, high density through-wafer via die stackingPRATT DAVE·Filed 2008·Granted Sep 15, 2015·21 cites·18 claims
- 0277US8546919B2Die stacking with an annular via having a recessed socketPRATT DAVE·Filed 2012·Granted Oct 1, 2013·3 cites·10 claims
- 0365US8227343B2Die stacking with an annular via having a recessed socketPRATT DAVE·Filed 2011·Granted Jul 24, 2012·1 cites·18 claims
- 0464US8531046B2Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backsidePRATT DAVE·Filed 2011·Granted Sep 10, 2013·1 cites·18 claims
- 0553US8629060B2Methods of forming through substrate interconnectsPRATT DAVE·Filed 2011·Granted Jan 14, 2014·0 cites·21 claims
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