Assignee

PROTOTYPE SOLUTIONS CORP

US·1 granted patent·31 citations·filing 1997–1997

Technology mixH05K1 Y02P1

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0166US6043990AMultiple board package employing solder balis and fabrication method and apparatusPROTOTYPE SOLUTIONS CORP·Filed 1997·Granted Mar 28, 2000·31 cites·31 claims

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