Assignee
PULSEFORGE INC
US·1 granted patent·9 pending applications·0 citations·filing 2022–2025
Top patents by PatentIndex Score
10 records- 0178US2026026387A1Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applicationsPULSEFORGE INC·Filed 2025·Application pending·0 cites
- 0271US2025022838A1Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applicationsPULSEFORGE INC·Filed 2024·Application pending·0 cites
- 0364US12559601B2Method for curing thermosetting polymersPULSEFORGE INC·Filed 2023·Granted Feb 24, 2026·0 cites·16 claims
- 0460US2026096395A1Carrier for debonding of bonded stack with passivation layerPULSEFORGE INC·Filed 2025·Application pending·0 cites
- 0558US2024384045A1Method for curing and releasing thermosetting polymers on a coated glass substratePULSEFORGE INC·Filed 2023·Application pending·0 cites
- 0649US2025358905A1Method and apparatus for thermal processing using pulsed resistance heatingPULSEFORGE INC·Filed 2025·Application pending·0 cites
- 0745US2025289215A1Method for attaching and detaching wafers during integrated circuit manufacturingPULSEFORGE INC·Filed 2024·Application pending·0 cites
- 0843US2025323207A1Method for bonding electronics structures during integrated electronics manufacturingPULSEFORGE INC·Filed 2025·Application pending·0 cites
- 0943US2025299995A1Roughened Carrier for Debonding of Bonded StackPULSEFORGE INC·Filed 2025·Application pending·0 cites
- 1042US2022306177A1Method for attaching and detaching substrates during integrated circuit manufacturingPULSEFORGE INC·Filed 2022·Application pending·0 cites
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