Assignee
QI DING TECH QINHUANGDAO CO LTD
CN·5 granted patents·1 pending application·4 citations·filing 2013–2019
Top patents by PatentIndex Score
6 records- 0175US9730328B2Printed circuit board with embedded component and method for manufacturing sameQI DING TECH QINHUANGDAO CO LTD·Filed 2013·Granted Aug 8, 2017·2 cites·4 claims
- 0272US9905508B2Package structureQI DING TECH QINHUANGDAO CO LTD·Filed 2017·Granted Feb 27, 2018·2 cites·10 claims
- 0356US10412835B2Package substrateQI DING TECH QINHUANGDAO CO LTD·Filed 2018·Granted Sep 10, 2019·0 cites·10 claims
- 0451US10501664B1Resin compositon, removable adhesive layer, IC substrate, and IC packaging processQI DING TECH QINHUANGDAO CO LTD·Filed 2018·Granted Dec 10, 2019·0 cites·20 claims
- 0543US2020163229A1Circuit board and method of making circuit boardQI DING TECH QINHUANGDAO CO LTD·Filed 2019·Application pending·0 cites
- 0636US9735097B1Package substrate, method for making the same, and package structure having the sameQI DING TECH QINHUANGDAO CO LTD·Filed 2016·Granted Aug 15, 2017·0 cites·19 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →