Assignee
QPL LTD
HK·2 granted patents·11 citations·filing 2003–2006
Top patents by PatentIndex Score
2 records- 0159US7504712B2Electronic device with selective nickel palladium gold plated leadframe and method of making the sameQPL LTD·Filed 2006·Granted Mar 17, 2009·5 cites·12 claims
- 0251US6822319B1Leadframe for enhanced downbond registration during automatic wire bond processQPL LTD·Filed 2003·Granted Nov 23, 2004·6 cites·7 claims
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