Assignee
QUANTUM LEAP PACKAGING INC
US·4 granted patents·1 pending application·118 citations·filing 2004–2008
Top patents by PatentIndex Score
5 records- 0193US6867367B2Package for integrated circuit dieQUANTUM LEAP PACKAGING INC·Filed 2004·Granted Mar 15, 2005·68 cites·67 claims
- 0284US7053299B2Flange for integrated circuit packageQUANTUM LEAP PACKAGING INC·Filed 2004·Granted May 30, 2006·28 cites·54 claims
- 0370US6977432B2Prefabricated semiconductor chip carrierQUANTUM LEAP PACKAGING INC·Filed 2004·Granted Dec 20, 2005·11 cites·12 claims
- 0465US7253365B2Die package for connection to a substrateQUANTUM LEAP PACKAGING INC·Filed 2004·Granted Aug 7, 2007·11 cites·25 claims
- 0547US2008305355A1Plastic electronic component packageQUANTUM LEAP PACKAGING INC·Filed 2008·Application pending·0 cites
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