Assignee
QUANZHOU SANAN INTEGRATED CIRCUIT CO LTD
CN·0 granted patents·11 pending applications·0 citations·filing 2024–2025
Top patents by PatentIndex Score
11 records- 0164US2025210477A1Semiconductor packaging structureQUANZHOU SANAN INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
- 0261US2026039272A1Substrate, Electronic Device, and ModuleQUANZHOU SANAN INTEGRATED CIRCUIT CO LTD·Filed 2025·Application pending·0 cites
- 0361US2026039274A1Substrate, Electronic Device, and ModuleQUANZHOU SANAN INTEGRATED CIRCUIT CO LTD·Filed 2025·Application pending·0 cites
- 0460US2026074669A1Substrate, Electronic Device, and ModuleQUANZHOU SANAN INTEGRATED CIRCUIT CO LTD·Filed 2025·Application pending·0 cites
- 0555US2025118700A1Semiconductor device and method of manufacturing the sameQUANZHOU SANAN INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
- 0646US2025392283A1Composite substrate and preparation method thereof, electronic device and moduleQUANZHOU SANAN INTEGRATED CIRCUIT CO LTD·Filed 2025·Application pending·0 cites
- 0744US2025211200A1Elastic wave device, manufacturing method thereof, and electronic moduleQUANZHOU SANAN INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
- 0842US2025211196A1Piezoelectric wafer and method of fabricating the same and acoustic wave device including the sameQUANZHOU SANAN INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
- 0940US2024388274A1Bonding structure and acoustic wave deviceQUANZHOU SANAN INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
- 1039US2025202451A1Support layer substrate, composite substrate, and electronic deviceQUANZHOU SANAN INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
- 1138US2026039273A1Support substrate, composite substrate, electronic device, and moduleQUANZHOU SANAN INTEGRATED CIRCUIT CO LTD·Filed 2025·Application pending·0 cites
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