Assignee
RATAKONDA DEEPA
US·2 granted patents·10 citations·filing 2011–2012
Top patents by PatentIndex Score
2 records- 0184US9331137B1Metal-insulator-metal capacitors between metal interconnect layersRATAKONDA DEEPA·Filed 2012·Granted May 3, 2016·10 cites·18 claims
- 0236US8912104B1Method for fabricating integrated circuits with patterned thermal adjustment layers for design optimizationRATAKONDA DEEPA·Filed 2011·Granted Dec 16, 2014·0 cites·14 claims
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