Assignee
RAYTECH INNOVATIVE SOLUTIONS L
US·4 granted patents·32 citations·filing 2003–2005
Top patents by PatentIndex Score
4 records- 0189US6945846B1Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of makingRAYTECH INNOVATIVE SOLUTIONS L·Filed 2005·Granted Sep 20, 2005·18 cites·9 claims
- 0263US7025668B2Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafersRAYTECH INNOVATIVE SOLUTIONS L·Filed 2003·Granted Apr 11, 2006·10 cites·4 claims
- 0350US6979256B2Retaining ring with wear pad for use in chemical mechanical planarizationRAYTECH INNOVATIVE SOLUTIONS L·Filed 2004·Granted Dec 27, 2005·4 cites·9 claims
- 0436US6964601B2Method for securing a polishing pad to a platen for use in chemical-mechanical polishing of wafersRAYTECH INNOVATIVE SOLUTIONS L·Filed 2003·Granted Nov 15, 2005·0 cites·10 claims
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