Assignee

REID JONATHAN

US·2 granted patents·91 citations·filing 2008–2009

Technology mixC25D2 H10P2 H10W2

Top patents by PatentIndex Score

2 records

0193US8308931B2Method and apparatus for electroplatingREID JONATHAN·Filed 2008·Granted Nov 13, 2012·62 cites·34 claims
0293US8168540B1Methods and apparatus for depositing copper on tungstenREID JONATHAN·Filed 2009·Granted May 1, 2012·29 cites·30 claims

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