Assignee
RESONAC CORP
JP·129 granted patents·480 pending applications·22 citations·filing 2018–2025
Top patents by PatentIndex Score
609 records- 0194US11705157B2Ferroelectric recording medium and ferroelectric storage apparatusRESONAC CORP·Filed 2021·Granted Jul 18, 2023·3 cites·9 claims
- 0293US12215439B2SiC epitaxial waferRESONAC CORP·Filed 2023·Granted Feb 4, 2025·1 cites·5 claims
- 0393US11866846B2SiC substrate and SiC epitaxial waferRESONAC CORP·Filed 2023·Granted Jan 9, 2024·2 cites·21 claims
- 0493US11820742B2Fluorine-containing ether compound, lubricant for magnetic recording medium, and magnetic recording mediumRESONAC CORP·Filed 2020·Granted Nov 21, 2023·3 cites·20 claims
- 0591US11939699B2SiC substrate and SiC ingotRESONAC CORP·Filed 2023·Granted Mar 26, 2024·1 cites·20 claims
- 0691US2026042945A1Method for producing polycrystalline alumina abrasive grainsRESONAC CORP·Filed 2025·Application pending·0 cites
- 0790US12084599B2Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation materialRESONAC CORP·Filed 2023·Granted Sep 10, 2024·2 cites·7 claims
- 0890US2025084294A1Slurry and polishing methodRESONAC CORP·Filed 2024·Application pending·0 cites
- 0990US2025129279A1Slurry, screening method, and polishing methodRESONAC CORP·Filed 2024·Application pending·0 cites
- 1089US12540419B2SiC epitaxial waferRESONAC CORP·Filed 2024·Granted Feb 3, 2026·0 cites·20 claims
- 1189US11781092B2Composition, and method for cleaning adhesive polymerRESONAC CORP·Filed 2020·Granted Oct 10, 2023·2 cites·14 claims
- 1289US2024425737A1Slurry, screening method, and polishing methodRESONAC CORP·Filed 2024·Application pending·0 cites
- 1388US12426164B2Semiconductor packageRESONAC CORP·Filed 2024·Granted Sep 23, 2025·0 cites·8 claims
- 1488US2024417509A1Epoxy resin, epoxy resin composition, epoxy resin cured product and method of producing epoxy resin cured product, composite material, insulating member, electronic appliance, structural material, and vehicleRESONAC CORP·Filed 2024·Application pending·0 cites
- 1587US12104009B2Epoxy resin, epoxy resin composition, epoxy resin cured product and method of producing epoxy resin cured product, composite material, insulating member, electronic appliance, structural material, and vehicleRESONAC CORP·Filed 2018·Granted Oct 1, 2024·1 cites·7 claims
- 1686US12546030B2SiC epitaxial wafer and method of manufacturing SiC epitaxial waferRESONAC CORP·Filed 2024·Granted Feb 10, 2026·1 cites·9 claims
- 1786US12252810B2SiC substrate and SiC ingotRESONAC CORP·Filed 2024·Granted Mar 18, 2025·0 cites·20 claims
- 1886US12188152B2SiC epitaxial wafer and method of manufacturing SiC epitaxial wafer preliminary classRESONAC CORP·Filed 2023·Granted Jan 7, 2025·1 cites·18 claims
- 1986US2025026934A1Silicon-containing oxide-coated aluminum nitride particle and method of manufacturing the sameRESONAC CORP·Filed 2024·Application pending·0 cites
- 2085US2025163309A1Polycrystalline alumina abrasive grains, method for producing the same, and grindstoneRESONAC CORP·Filed 2024·Application pending·0 cites
- 2185US2025368839A1Coating liquid, production method for coating film, and coating filmRESONAC CORP·Filed 2025·Application pending·0 cites
- 2284US2025215611A1SiC INGOT AND METHOD FOR MANUFACTURING SiC SUBSTRATERESONAC CORP·Filed 2024·Application pending·0 cites
- 2384US2025215610A1SiC INGOT AND METHOD FOR MANUFACTURING SiC SUBSTRATERESONAC CORP·Filed 2024·Application pending·0 cites
- 2482US12595184B2Inorganic oxide particlesRESONAC CORP·Filed 2023·Granted Apr 7, 2026·0 cites·12 claims
- 2582US11871542B2User device and caseRESONAC CORP·Filed 2020·Granted Jan 9, 2024·2 cites·10 claims
- 2681US12084789B28-inch n-type SiC single crystal substrateRESONAC CORP·Filed 2023·Granted Sep 10, 2024·0 cites·8 claims
- 2780US12227875B2SiC wafer and SiC epitaxial waferRESONAC CORP·Filed 2023·Granted Feb 18, 2025·0 cites·10 claims
- 2880US12151941B2SiC substrate and SiC ingotRESONAC CORP·Filed 2023·Granted Nov 26, 2024·0 cites·13 claims
- 2980US2024282684A1Substrate and method for manufacturing the sameRESONAC CORP·Filed 2024·Application pending·0 cites
- 3080US2025215612A1SiC INGOT AND METHOD FOR MANUFACTURING SiC SUBSTRATERESONAC CORP·Filed 2024·Application pending·0 cites
- 3180US2024401234A18-INCH N-TYPE SiC SINGLE CRYSTAL SUBSTRATERESONAC CORP·Filed 2024·Application pending·0 cites
- 3280US2023211413A1Iron-based sintered alloy material and production method thereforRESONAC CORP·Filed 2023·Application pending·0 cites
- 3379US12534826B2SiC substrate and SiC epitaxial waferRESONAC CORP·Filed 2024·Granted Jan 27, 2026·0 cites·16 claims
- 3479US12356687B2SiC epitaxial wafer and method for manufacturing SiC epitaxial waferRESONAC CORP·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 3579US12142764B2Positive electrode mixture layer, conductive additive, positive electrode mixture, and lithium-ion secondary batteryRESONAC CORP·Filed 2023·Granted Nov 12, 2024·0 cites·15 claims
- 3679US12037249B2SiC substrate and SiC ingotRESONAC CORP·Filed 2023·Granted Jul 16, 2024·0 cites·12 claims
- 3779US2025003902A1Method of measuring physical properties, method of evaluating member, method of manufacturing electronic component device, method of manufacturing material for electronic component device, and physical property measurement systemRESONAC CORP·Filed 2024·Application pending·0 cites
- 3878US12584243B2SiC epitaxial waferRESONAC CORP·Filed 2024·Granted Mar 24, 2026·0 cites·9 claims
- 3978US12516444B2SiC single crystal substrateRESONAC CORP·Filed 2023·Granted Jan 6, 2026·0 cites·6 claims
- 4078US12322427B2Ferroelectric storage apparatus and manufacturing method of conductive probeRESONAC CORP·Filed 2024·Granted Jun 3, 2025·0 cites·5 claims
- 4178US2026004969A1Device for manufacturing permanent magnetRESONAC CORP·Filed 2025·Application pending·0 cites
- 4277US12365815B2Polishing liquid, polishing liquid set, polishing method, and defect suppression methodRESONAC CORP·Filed 2023·Granted Jul 22, 2025·0 cites·18 claims
- 4377US2026060078A1Heat conduction sheet, heat dissipating device, and method of manufacturing heat conduction sheetRESONAC CORP·Filed 2025·Application pending·0 cites
- 4476US2026053048A1Method for manufacturing semiconductor device and semiconductor deviceRESONAC CORP·Filed 2025·Application pending·0 cites
- 4576US2024383035A1Electronic component and method for manufacturing electronic componentRESONAC CORP·Filed 2024·Application pending·0 cites
- 4675US12423804B2Image analysis apparatus and method for determining shape of particle included in image of objectRESONAC CORP·Filed 2024·Granted Sep 23, 2025·0 cites·12 claims
- 4775US12233460B2Copper paste, wick formation method, and heat pipeRESONAC CORP·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 4875US11859313B28-inch SiC single crystal substrateRESONAC CORP·Filed 2023·Granted Jan 2, 2024·0 cites·14 claims
- 4975US2026002054A1Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheetRESONAC CORP·Filed 2024·Application pending·0 cites
- 5074US12544832B2Copper paste, wick formation method, and heat pipeRESONAC CORP·Filed 2025·Granted Feb 10, 2026·0 cites·20 claims
Showing the top 50 of 609 patent records by PatentIndex Score.
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