Assignee
RJR POLYMERS INC
US·5 granted patents·255 citations·filing 1995–2001
Top patents by PatentIndex Score
5 records- 0185US5706579AMethod of assembling integrated circuit packageRJR POLYMERS INC·Filed 1996·Granted Jan 13, 1998·68 cites·6 claims
- 0285US5572070AIntegrated circuit packages with heat dissipation for high current loadRJR POLYMERS INC·Filed 1995·Granted Nov 5, 1996·73 cites·23 claims
- 0382US6511866B1Use of diverse materials in air-cavity packaging of electronic devicesRJR POLYMERS INC·Filed 2001·Granted Jan 28, 2003·58 cites·25 claims
- 0462US5816158AInverted stamping processRJR POLYMERS INC·Filed 1997·Granted Oct 6, 1998·26 cites·11 claims
- 0561US6214152B1Lead frame moisture barrier for molded plastic electronic packagesRJR POLYMERS INC·Filed 1999·Granted Apr 10, 2001·30 cites·16 claims
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