Assignee
ROGERS GERMANY GMBH
DE·23 granted patents·14 pending applications·8 citations·filing 2014–2023
Top patents by PatentIndex Score
37 records- 0177US11338397B2Soldering material for active soldering and method for active solderingROGERS GERMANY GMBH·Filed 2018·Granted May 24, 2022·2 cites·5 claims
- 0272US11845700B2Method for producing a semi-finished metal product, method for producing a metal-ceramic substrate, and metal-ceramic substrateROGERS GERMANY GMBH·Filed 2018·Granted Dec 19, 2023·1 cites·7 claims
- 0372US10351477B2Method for producing a metal-ceramic substrateROGERS GERMANY GMBH·Filed 2014·Granted Jul 16, 2019·4 cites·12 claims
- 0466US10940671B2Substrate for electrical circuits and method for producing a substrate of this typeROGERS GERMANY GMBH·Filed 2016·Granted Mar 9, 2021·1 cites·23 claims
- 0560US12226856B2Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layerROGERS GERMANY GMBH·Filed 2020·Granted Feb 18, 2025·0 cites·13 claims
- 0659US11945054B2Method for producing a metal-ceramic substrate, solder system, and metal-ceramic substrate produced using such a methodROGERS GERMANY GMBH·Filed 2020·Granted Apr 2, 2024·0 cites·16 claims
- 0759US2024139884A1Method for processing a metal-ceramic substrate, and metal-ceramic substrateROGERS GERMANY GMBH·Filed 2022·Application pending·0 cites
- 0858US12495491B2Process for producing a metal-ceramic substrate, and a metal-ceramic substrate produced using such methodROGERS GERMANY GMBH·Filed 2021·Granted Dec 9, 2025·0 cites·17 claims
- 0955US2025203752A1Printed circuit board, metal-ceramic substrate as an insert, and method for manufacturing a printed circuit boardROGERS GERMANY GMBH·Filed 2023·Application pending·0 cites
- 1054US2025048556A1Metal-ceramic substrate and method for producing a metal ceramic substrateROGERS GERMANY GMBH·Filed 2022·Application pending·0 cites
- 1154US2024157482A1Method for machining a metal-ceramic substrate, system for such a method and metal-ceramic substrates produced using such a methodROGERS GERMANY GMBH·Filed 2020·Application pending·0 cites
- 1252US2014334103A1Cooled electric unitROGERS GERMANY GMBH·Filed 2014·Application pending·0 cites
- 1351US12177970B2Support substrate and method for producing a support substrateROGERS GERMANY GMBH·Filed 2021·Granted Dec 24, 2024·0 cites·20 claims
- 1451US12035477B2Electronic module and method for producing an electronic moduleROGERS GERMANY GMBH·Filed 2021·Granted Jul 9, 2024·0 cites·15 claims
- 1550US12552722B2Process for producing a metal-ceramic substrate, and a metal-ceramic substrate produced using such a methodROGERS GERMANY GMBH·Filed 2021·Granted Feb 17, 2026·0 cites·15 claims
- 1649US12058816B2Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a methodROGERS GERMANY GMBH·Filed 2020·Granted Aug 6, 2024·0 cites·9 claims
- 1749US2021379700A1Method for machining a metal ceramic substrate, system for carrying out said method, and metal-ceramic substrate manufactured by using said methodROGERS GERMANY GMBH·Filed 2019·Application pending·0 cites
- 1849US2024178098A1Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using a method of this typeROGERS GERMANY GMBH·Filed 2022·Application pending·0 cites
- 1948US10821704B2Substrate for electrical circuits and method for producing a substrate of this typeROGERS GERMANY GMBH·Filed 2016·Granted Nov 3, 2020·0 cites·14 claims
- 2047US2025185166A1Metal-ceramic substrate and method of manufacturing a metal-ceramic substrateROGERS GERMANY GMBH·Filed 2023·Application pending·0 cites
- 2146US2024155770A1Printed circuit board, metal-ceramic substrate as an insert, and process for manufacturing such an insertROGERS GERMANY GMBH·Filed 2022·Application pending·0 cites
- 2245US11807584B2Metal-ceramic substrate and method for producing a metal-ceramic substrateROGERS GERMANY GMBH·Filed 2019·Granted Nov 7, 2023·0 cites·9 claims
- 2344US11330707B2Carrier substrate for electrical, more particularly electronic, components, and method for producing a carrier substrateROGERS GERMANY GMBH·Filed 2019·Granted May 10, 2022·0 cites·18 claims
- 2444US11129273B2Metal-ceramic substrate and method for producing a metal-ceramic substrateROGERS GERMANY GMBH·Filed 2019·Granted Sep 21, 2021·0 cites·18 claims
- 2543US2022415754A1Method for Producing a Cooling Element, and Cooling Element Produced Using Such a MethodROGERS GERMANY GMBH·Filed 2021·Application pending·0 cites
- 2641US11848248B2System for cooling a metal-ceramic substrate, a metal-ceramic substrate and method for manufacturing the systemROGERS GERMANY GMBH·Filed 2019·Granted Dec 19, 2023·0 cites·17 claims
- 2740US12075557B2Metal ceramic substrate and method for manufacturing such metal ceramic substrateROGERS GERMANY GMBH·Filed 2020·Granted Aug 27, 2024·0 cites·24 claims
- 2840US2025054832A1Carrier substrate for electrical components, and method for producing such a carrier substrateROGERS GERMANY GMBH·Filed 2022·Application pending·0 cites
- 2939US11552446B2Cooling device for cooling an electrical component and method for producing a cooling deviceROGERS GERMANY GMBH·Filed 2018·Granted Jan 10, 2023·0 cites·18 claims
- 3038US2023137460A1Method for producing a via in a carrier layer produced from a ceramic and carrier layer having a viaROGERS GERMANY GMBH·Filed 2018·Application pending·0 cites
- 3137US12531390B2Adapter element for connecting an electronics component to a heat sink element, system comprising an adapter element of this kind, and method for producing an adapter element of this kindROGERS GERMANY GMBH·Filed 2020·Granted Jan 20, 2026·0 cites·9 claims
- 3237US11564307B2Carrier substrate with a thick metal interlayer and a cooling structureROGERS GERMANY GMBH·Filed 2017·Granted Jan 24, 2023·0 cites·13 claims
- 3337US2022247150A1Method for producing a cooling element, and cooling element produced using such a methodROGERS GERMANY GMBH·Filed 2020·Application pending·0 cites
- 3434US12575440B2Electronics module and method for producing itROGERS GERMANY GMBH·Filed 2019·Granted Mar 10, 2026·0 cites·20 claims
- 3534US2023294213A1Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using a method of this typeROGERS GERMANY GMBH·Filed 2021·Application pending·0 cites
- 3633US11476640B2Adapter element for connecting a component, such as a laser diode, to a heat sink, a system comprising a laser diode, a heat sink and an adapter element and method for producing an adapter elementROGERS GERMANY GMBH·Filed 2018·Granted Oct 18, 2022·0 cites·14 claims
- 3731US10448504B2Method for producing a composite materialROGERS GERMANY GMBH·Filed 2016·Granted Oct 15, 2019·0 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when ROGERS GERMANY GMBH files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →