Assignee
RUBEN DAVID A
US·5 granted patents·150 citations·filing 1995–2011
Top patents by PatentIndex Score
5 records- 0198US8433402B2Hermetic wafer-to-wafer bonding with electrical interconnectionRUBEN DAVID A·Filed 2011·Granted Apr 30, 2013·104 cites·33 claims
- 0296US8796109B2Techniques for bonding substrates using an intermediate layerRUBEN DAVID A·Filed 2010·Granted Aug 5, 2014·36 cites·37 claims
- 0375US8141556B2Metallization with tailorable coefficient of thermal expansionRUBEN DAVID A·Filed 2007·Granted Mar 27, 2012·6 cites·10 claims
- 0462US8461681B2Layered structure for corrosion resistant interconnect contactsRUBEN DAVID A·Filed 2007·Granted Jun 11, 2013·2 cites·35 claims
- 0536USD375682SContainerRUBEN DAVID A·Filed 1995·Granted Nov 19, 1996·2 cites·1 claims
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