Assignee
RYAN E TODD
US·3 granted patents·4 citations·filing 2007–2009
Top patents by PatentIndex Score
3 records- 0160US8592312B2Method for depositing a conductive capping layer on metal linesRYAN E TODD·Filed 2007·Granted Nov 26, 2013·2 cites·20 claims
- 0258US8212346B2Method and apparatus for reducing semiconductor package tensile stressRYAN E TODD·Filed 2008·Granted Jul 3, 2012·2 cites·9 claims
- 0345US8324093B2Methods for fabricating semiconductor devices including azeotropic drying processesRYAN E TODD·Filed 2009·Granted Dec 4, 2012·0 cites·19 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →