Assignee
RYAN VIVIAN W
US·7 granted patents·238 citations·filing 2011–2012
Top patents by PatentIndex Score
7 records- 0198US8441131B2Strain-compensating fill patterns for controlling semiconductor chip package interactionsRYAN VIVIAN W·Filed 2011·Granted May 14, 2013·224 cites·25 claims
- 0286US8623754B1Repairing anomalous stiff pillar bumpsRYAN VIVIAN W·Filed 2012·Granted Jan 7, 2014·8 cites·24 claims
- 0370US9021894B2Detecting anomalous weak BEOL sites in a metallization systemRYAN VIVIAN W·Filed 2012·Granted May 5, 2015·3 cites·20 claims
- 0467US9269615B2Multi-layer barrier layer for interconnect structureRYAN VIVIAN W·Filed 2012·Granted Feb 23, 2016·2 cites·20 claims
- 0563US8680681B2Bond pad configurations for controlling semiconductor chip package interactionsRYAN VIVIAN W·Filed 2011·Granted Mar 25, 2014·1 cites·25 claims
- 0652US8728931B2Multi-layer barrier layer for interconnect structureRYAN VIVIAN W·Filed 2012·Granted May 20, 2014·0 cites·21 claims
- 0744US8950269B2Detecting anomalous stiff pillar bumps formed above a metallization systemRYAN VIVIAN W·Filed 2012·Granted Feb 10, 2015·0 cites·20 claims
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