Assignee
SADAKA MARIAM
US·15 granted patents·4 pending applications·739 citations·filing 2007–2012
Top patents by PatentIndex Score
19 records- 0199US8697493B2Bonding surfaces for direct bonding of semiconductor structuresSADAKA MARIAM·Filed 2011·Granted Apr 15, 2014·225 cites·13 claims
- 0298US8716105B2Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methodsSADAKA MARIAM·Filed 2011·Granted May 6, 2014·219 cites·28 claims
- 0398US8501537B2Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methodsSADAKA MARIAM·Filed 2011·Granted Aug 6, 2013·221 cites·18 claims
- 0496US8461017B2Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened regionSADAKA MARIAM·Filed 2010·Granted Jun 11, 2013·27 cites·21 claims
- 0589US9245836B2Interposers including fluidic microchannels and related structures and methodsSADAKA MARIAM·Filed 2012·Granted Jan 26, 2016·8 cites·10 claims
- 0688US8673733B2Methods of transferring layers of material in 3D integration processes and related structures and devicesSADAKA MARIAM·Filed 2011·Granted Mar 18, 2014·10 cites·26 claims
- 0787US8338294B2Methods of forming bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate, and semiconductor structures formed by such methodsSADAKA MARIAM·Filed 2011·Granted Dec 25, 2012·8 cites·12 claims
- 0886US8970045B2Methods for fabrication of semiconductor structures including interposers with conductive vias, and related structures and devicesSADAKA MARIAM·Filed 2012·Granted Mar 3, 2015·7 cites·27 claims
- 0985US8481406B2Methods of forming bonded semiconductor structuresSADAKA MARIAM·Filed 2010·Granted Jul 9, 2013·7 cites·24 claims
- 1073US8778773B2Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methodsSADAKA MARIAM·Filed 2010·Granted Jul 15, 2014·3 cites·42 claims
- 1171US8890299B2Bonded semiconductor structures and methods of forming sameSADAKA MARIAM·Filed 2011·Granted Nov 18, 2014·4 cites·19 claims
- 1253US8980688B2Semiconductor structures including fluidic microchannels for cooling and related methodsSADAKA MARIAM·Filed 2012·Granted Mar 17, 2015·0 cites·12 claims
- 1351US2010061877A1Magnetic materials, and methods of formationSADAKA MARIAM·Filed 2008·Application pending·0 cites
- 1449US2012248621A1Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methodsSADAKA MARIAM·Filed 2011·Application pending·0 cites
- 1543US9136134B2Methods of providing thin layers of crystalline semiconductor material, and related structures and devicesSADAKA MARIAM·Filed 2012·Granted Sep 15, 2015·0 cites·35 claims
- 1642US2009004475A1Magnetic materials made from magnetic nanoparticles and associated methodsSADAKA MARIAM·Filed 2007·Application pending·0 cites
- 1741US8617925B2Methods of forming bonded semiconductor structures in 3D integration processes using recoverable substrates, and bonded semiconductor structures formed by such methodsSADAKA MARIAM·Filed 2011·Granted Dec 31, 2013·0 cites·20 claims
- 1839US2012061794A1Methods of forming through wafer interconnects in semiconductor structures using sacrificial material, and semiconductor structures formed by such methodsSADAKA MARIAM·Filed 2010·Application pending·0 cites
- 1933US9034727B2Methods and structures for forming integrated semiconductor structuresSADAKA MARIAM·Filed 2011·Granted May 19, 2015·0 cites·19 claims
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