Assignee
SAKO NOBUYUKI
JP·3 granted patents·1 pending application·15 citations·filing 2011–2013
Top patents by PatentIndex Score
4 records- 0184US8546232B2Method of manufacturing a semiconductor device having a laminated structure comprising a boron-doped silicon germanium film and a metal filmSAKO NOBUYUKI·Filed 2012·Granted Oct 1, 2013·9 cites·19 claims
- 0274US8580681B2Manufacturing method of deviceSAKO NOBUYUKI·Filed 2012·Granted Nov 12, 2013·4 cites·12 claims
- 0363US9147686B2Method for forming semiconductor deviceSAKO NOBUYUKI·Filed 2011·Granted Sep 29, 2015·2 cites·5 claims
- 0438US2015333117A1Semiconductor device and manufacturing method thereofSAKO NOBUYUKI·Filed 2013·Application pending·0 cites
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