Assignee
SAKURA FINETEK JAPAN CO LTD
JP·9 granted patents·19 citations·filing 2013–2014
Top patents by PatentIndex Score
9 records- 0190US9164014B2Thin section fabrication apparatus and method of fabricating thin sectionSAKURA FINETEK JAPAN CO LTD·Filed 2013·Granted Oct 20, 2015·10 cites·7 claims
- 0277US9423325B2Block storage device and automatic thin-cutting deviceSAKURA FINETEK JAPAN CO LTD·Filed 2013·Granted Aug 23, 2016·4 cites·5 claims
- 0372US10488303B2Replacement blade supplying mechanismSAKURA FINETEK JAPAN CO LTD·Filed 2013·Granted Nov 26, 2019·2 cites·3 claims
- 0459US11248991B2Thin-section preparation method and thin-section preparation deviceSAKURA FINETEK JAPAN CO LTD·Filed 2013·Granted Feb 15, 2022·1 cites·11 claims
- 0559US10175678B2Automatic thin-cutting device, parameter generation device, automatic thin-cutting method, and programSAKURA FINETEK JAPAN CO LTD·Filed 2013·Granted Jan 8, 2019·1 cites·6 claims
- 0651US9527681B2Thin-section sample fabrication apparatus and method of fabricating thin-section sampleSAKURA FINETEK JAPAN CO LTD·Filed 2013·Granted Dec 27, 2016·1 cites·3 claims
- 0749US9291532B2Automatic thin section sample preparation deviceSAKURA FINETEK JAPAN CO LTD·Filed 2013·Granted Mar 22, 2016·0 cites·6 claims
- 0846US9983100B2Thin section preparation deviceSAKURA FINETEK JAPAN CO LTD·Filed 2013·Granted May 29, 2018·0 cites·3 claims
- 0944US10018535B2Thin-slice manufacturing device and thin-slice manufacturing methodSAKURA FINETEK JAPAN CO LTD·Filed 2014·Granted Jul 10, 2018·0 cites·12 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →